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Technical Design


 

Amount:

Prototyp, small and medium series,

From 1 pieces
Larger quantities available on request.

PCB dimensions:

Minimum: 20mm x 5mm
Maximum: 4
10mm x 500mm

Components:

SMD and THT
from size 0402 and up

SOIC, PLCC, QFP, PQFP, TSOP, BGA

Assembly method:

single- and double-sided
SMD (soldered by Reflow Soldering machine)
THT (soldered manually or by
Wave Soldering machine)

Component packaging:

Tape strip (taped)
Sticks
Reels
Bulk material
(loose)*

 

Cut tape

Tube

Maximum component size:

Fine Pitch from 0,5mm
Minimum Pin width 0,2mm

Solder Paste:

Solder Wire:

 

 

File formats:

BOM(Bill of materials)

Pick and Place Data

Layout

We also accept Eagle** and Target Format

Assembly time:

Up to 5000 Components – 5 Working days(Standart)

Up to 10000 Components – 10 Working days (Standart)

Over 10000 Components 

 

First work day starts from the day on which all the components required for assembly have arrived

Tip:

For passive 0603 components or larger, please supply us with a 20% surplus (min. 10pcs). For 0402 components, please supply a 100% surplus (min. 10pcs).

If a component should not fit in the planned footprint, or not be possible to assemble for some other reason, we will
contact you und try to solve the problem quickly, we won’t solder the Parts without your permission.

Supplier:

We are able to order components by follow Distributors:

Farnell

Digykey

Mauser

And others.

*

- only for Muster or after prior agreement

- - Please pay attention that all components that are poorly packed could be damaged during shipment.  So you should avoid to send the parts as a "loose".

**

Please don’t  forget to send a Eagle Schematic File (.sch) for creation of BOM Data .